Sputtering is one of the main technologies for preparing thin films. It uses the ions generated in the ion source, after accelerated aggregation in vacuum, to form high speed ion beam. Bombarding the solid surface, and the iron and the atoms of solid surface energy exchange, to make the atoms on the solid surface leave the solid and deposit on the substrate surface. The being bombarded solid used raw materials of sputtered films, which is known as the sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, planar display and surface coating.

The sputtering target is mainly used in electronic and information industry, such as integrated circuit, data storage, LCD display, laser memory, electronic control devices, etc., and also is applied to the field of glass coating, wear-resistant materials, high-temperature corrosion resistance, high grade decoration products and other industries.

There are many kinds of sputtering target, and there are different ways to classify the target:

According to the shape, the target is divided into long, square target, round target.
According to the composition, it can be divided into metal target, alloy target, ceramic compound target.
According to the application, it can be divided into ceramic targets, recording ceramic targets, superconducting ceramic targets and giant magnetoresistance ceramic targets, etc.
According to the application field, it can be divided into microelectronic target, magnetic recording target, optical disk target, precious metal target, thin film resistance target, conductive film target, surface modified target, mask layer target, decorative layer target, electrode target, other target.

W, Mo, Ti target produced by our company has high density, high purity, high processing precision, fine grain, uniform structure and so on.